Used DATACON / BESI 8800 #9156737 for sale

DATACON / BESI 8800
Manufacturer
DATACON / BESI
Model
8800
ID: 9156737
Chip bonder.
DATACON / BESI 8800 is a high-performance automtic gold ball bonder designed with reliability and efficient production in mind. The bonder is capable of positioning, stitching and attaching precision gold ball bonds in applications including electronics, automotive components and aerospace components. BESI 8800 has a high-precision, 4-axis control that provides accuracy of ±1 μm in X, Y, Z and R axes when operating. It can bond wires with a diameter of 0.1 - 0.13 mm with a repeat wiring accuracy of 0.0025 mm, and the pressure of the wire is adjustable. The bonder also has the ability to pause the bond process partway through a cycle, and continue it at a later time, allowing the user to switch off the device without losing their place. DATACON 8800 is easy to use, and comes with a centralised controller to enable operators to easily programme user-defined parameters and schedules. The user-friendly graphical user interface (GUI) displays real-time operating information, as well as helpful visual representation of all wiring data. The user can also monitor and tweak up to four bonding recipes at the same time while operating. This gem of a gold ball bonder also offers a variety of reliable, energy efficient measures to reduce production costs and the environmental impact of manufacturing processes. 8800 offers an automatic operator-controlled air purge function that prevents deterioration of the bonding tips due to external air effects, and maintains the purity of the gold wire. It also has a titanium heating mechanism with a built-in temperature safeguard to ensure optimal temperature all times. DATACON / BESI 8800 is a reliable and accurate means of gold ball bonding on a production scale. It is designed for flexibility, ease of use and safety, and the robust features make it a great choice for highly precise gold ball bonding.
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