Used DATACON / BESI 8800 #9315349 for sale

Manufacturer
DATACON / BESI
Model
8800
ID: 9315349
Die bonder 2010 vintage.
DATACON / BESI 8800 is a robotic flip-chip bonding tool designed to meet stringent accuracy and throughput requirements.It is a fully automated, reliable, and versatile system that is suitable for a range of die attach applications. It is used in advanced flip-chip and multi-die technology and is capable of meeting the miniaturization needs of microelectronic designs. BESI 8800 features a micro-dispensing system which precisely positions and dispenses accurate quantities of solder paste, epoxy, or other bonding media and precisely aligns substrates for proper contact. With dual fiducial alignment cameras, high precision part alignment is achieved with 0.3 micron accuracy. The tool's Vacuum Die bonder performs die-to-substrate transferring and placement with exceptional repeatability. DATACON 8800 is also equipped with electrical test capability, to ensure proper electrical connection for next steps in the production process. 8800 combines the MicroROC-II controller and a BESI/DATACON Cognex machine vision system for reliable and efficient die bonding. This provides repeatable, programmable speed and accuracy even in challenging environments. Combined with its high precision servo motors, DATACON / BESI 8800 provides impressive repeatability and throughput, even for the most sophisticated bonder applications. BESI 8800's software is menu-driven, allowing direct execution of bonding programs and data management. It also includes the ability to perform process optimization routines, as well as the ability to sequence multiple different parts in a single bonder operation. In addition to reliable, repeatable and high-accuracy bonding, DATACON 8800 also provides manual accessibility, allowing the user to change program parameters as needed. This tool is compatible with all industry-standard operating systems, and is capable of integrating with other factory automation processes. Overall, 8800 is a highly reliable and precise tool for flip-chip and multi-die bonder applications. Its versatile and programmable features make it perfect for meeting the miniaturization needs of modern microelectronic designs. With a robust design and high-precision servo motors, DATACON / BESI 8800 ensures repeatable accuracy and efficient throughput for optimal productivity.
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