Used DATACON FC 8800 #9385541 for sale

DATACON FC 8800 is a highly advanced bonder that is designed to meet the needs of the most demanding die bonding tasks. This machine comes with both manual and automated options, making it easy to customize the process to the desired parameters. It is designed to handle most sizes of die from 8 mils (0.2mm) to 18 mils (0.5mm). Bonding parameters and other settings can all be controlled using the integrated touch panel display. FC 8800 is equipped with a 1 kW laser diode that is capable of delivering laser power of up to 20 watts. The response speed of the laser source is adjustable, with the fastest time of 60µs achievable. The laser diode, together with the automated joysticks and other functional components, ensure that precise placement of the die and accurate alignment of bonding sites is achieved. The design of the machine also includes an adjustable spot size for various die sizes, a cushioned sit-down station that prevents the vibration of the equipment, and a high-efficiency cooling system. DATACON FC 8800 features a custom software that simplifies the operation and makes sure that the user's data is accurately managed. The machine also includes a digital interface that allows connectivity to computers or PLCs. The software allows for periodic and emergency stop safety controls, and for complete diagnostics of the machine's health, enabling predictive maintenance. Overall, FC 8800 is an ideal choice for any die bonding application. It is designed to offer unprecedented levels of performance and reliability while being highly user friendly. This machine will save time and money while helping to increase productivity and quality in die bonding operations.