Used DATACON FC 8800 #9385542 for sale

DATACON FC 8800 is a high-end semiconductor bonder designed for precision die-attach applications. It combines a high-precision XYZ stage with a bonded substrate table for accurate bonding of small areas requiring complex placement and joining of packages, dies and substrates. FC 8800 also features an integrated vision equipment which allows for automatic identification of bond locations and precise bonding to within ± 0.2 micron of the desired location. The XYZ stage on DATACON FC 8800 is a contact-style, servo-motor driven stage which provides sub-micron accuracy for movements in the X, Y and Z axes. This stage allows for the accurate placement of DAP dies and packages during the die attach process. Controlling the XYZ stage are the number of servo control boards included with FC 8800. The control boards include three feedback circuits; pitch, yaw and roll. These three circuits are used to calculate the movement of the XYZ stage in relation to the bond site. DATACON FC 8800 also features an integrated vision system which allows for automated identification of bond sites and packages. This is achieved by first taking an image of the substrate on the bonded substrate table. This image is then used to calculate the exact position of the package or die with a precision of better than ± 0.2 micron. The vision unit also includes a color tracking feature which aids in the alignment of the die to its designated bond site. The thermal control machine of FC 8800 is designed for precision temperature control during the die attach process. It features a quartz insulated section which consists of temperature sensors and heaters. These heaters are used to adjust the temperature of the heater block while the temperature sensors are used to monitor the temperature of the particles and ensure precise temperature regulation during bonding. The electric power supply of DATACON FC 8800 is capable of providing up to 80 A of current for the bond process. This current adjusts automatically to compensate for differences in particle size and composition. The power supply also features an integrated ramp control tool which helps to ensure uniform and consistent bond quality between particles. In conclusion, FC 8800 is an advanced bonder designed for precision die-attach applications. It possesses an integrated vision asset which provides highly accurate positioning of packages and dies for successful bonding. DATACON FC 8800 also features an advanced thermal control model and electric power supply for uniform and consistent bond quality.