Used DATACON / QUANTUM FC 8800 #9212779 for sale

DATACON / QUANTUM FC 8800 is a state-of-the-art, high-speed, automated wire bonding equipment designed for demanding, high-volume applications. The system is capable of handling a broad range of discrete, semiconductor components for attachment. It also accommodates larger components such as standard resistor-capacitor (R-C) packs, and even multiple leads on the same side of the component. DATACON FC 8800 utilizes a unique bonder head design featuring a highly controllable, full range of motion within an exceptionally compact workspace. This allows for unprecedented precision in the placement and application of wire bonds. The unit also features an advanced vision machine, a real-time Flight Motion Program (FMP) for precise ball and wedge bonds, and a 5-axis fine motion control for continuously monitored bond control. The tool accommodates up to 14 feeders, with six feeders per side, for optimum throughput. Its low-profile design allows for extremely high wire loop height, while its full matrix conveyance asset enables high end-to-end throughput times, quicker cycle times, and better dwell time control. Aside from its automated features, the model includes numerous user-friendly features for serious professionals. The equipment offers an intuitive, easy-to-use interface and a highly efficient and reliable JIT data transfer which eliminates the need for manual-data entry. Additionally, the system provides high mechanical and thermal stability that improves product reliability. Overall, QUANTUM FC 8800 is a versatile and high-performance automated wire bonding unit designed to meet the needs of high-volume electronics manufacturers. With its advanced design, intuitive user interface, and high level of precision, this machine ensures superior product quality and highly reliable bond connections.