Used DIAS AUTOMATION IS-33 #9302056 for sale
URL successfully copied!
DIAS AUTOMATION IS-33 is a high-performance, automated bonder designed for accurate and reliable bonding of interconnect components such as zero insertion force (ZIF) connectors, packages, and other components. IS-33 is equipped with a full-color display and user-friendly menus that provide greater speed and flexibility for the bonding process. DIAS AUTOMATION IS-33 also has a two-stage thermocouple control equipment for precise control of the temperature profile of a bond. IS-33 automated bonder has integrated, high-performance imaging capabilities to provide precise visual control of the bond position before and after bonding. A high-temperature heating system provides full coverage of the bond area and DIAS AUTOMATION IS-33 is outfitted with a unique, quick-clamp vacuum unit that easily and effectively pulls and holds a package in place for bonding. IS-33 is also equipped with a three-dimensional alignment machine that provides automated alignment of components for accurate and repeatable bond placement with better than 0.1mm accuracy. DIAS AUTOMATION IS-33 also has an optional high-speed, ultra-precise vision tool for alignment of component pins and for automatic correction if any displacement is detected. IS-33 is a highly efficient tool for manufacturing operations and can be used in combination with other automated systems including pick and place tools and wafer probing. DIAS AUTOMATION IS-33 is capable of producing reliable and high-quality bonding with minimal waste and reduced cycle times. Additionally, it comes with a temperature alarm asset that monitors the bond temperature and the thermal alignment of components. as well as an active cycle counter to monitor production run efficiency. IS-33 is a highly reliable and efficient tool and can be used in a broad range of industrial applications with a wide range of products. The efficient features and programming capabilities of DIAS AUTOMATION IS-33 make it a perfect choice for any production environment that requires high performance, accuracy, and flexibility.
There are no reviews yet