Used DIAS AUTOMATION IS-33 #9302057 for sale

DIAS AUTOMATION IS-33 is an automated bonding equipment designed to increase accuracy and efficiency in the production of electrical components. The system works by bonding two or more metal surfaces together using electrical current generated by a power unit. This unit is ideal for joining thin films, printed circuit boards and various other substrates. The machine is adjustable and can be used for working on different sizes and shapes of components. IS-33 consists of a control unit, a bonding head and a power unit. The control unit is programmed to adjust the parameters of the process, as well as to monitor, log and analyze data during the bonding process. The bonding head is designed with two independently adjustable electrodes, allowing production of various shapes. A liquid cryogenic tank resides on the head, allowing thin bond gaps to be readily filled. The power unit is installed with integrated current controls to optimize the development of the bond. All these components ensure a reliable and repeatable process. DIAS AUTOMATION IS-33 represents a superior solution for production of electrical components on high volume applications. When compared to traditional manual bonding methods, IS-33 is able to provide a greater degree of accuracy and consistency. This enhanced level of performance ensures that components will be formed with precision and with fewer defects. This ultimately reduces the amount of waste material and production time, both of which result in lower overall production costs. Additionally, this tool requires minimal maintenance and can be operated with minimal staff. In conclusion, DIAS AUTOMATION IS-33 is an ideal bonding asset for production of electrical components on high volume applications. This automated bonding model is capable of providing accuracy and repeatability that is unachievable by traditional methods, resulting in a cost-effective solution for the production of quality components.