Used EFC ZE1537 #9247219 for sale

EFC ZE1537 is a high-performance bonder that is constructed to meet the needs of rapid prototyping and small to medium production applications. This robust and efficient automatic bonder offers precision and repeatability with superior field-to-field alignment for high yield and quality. ZE1537 features an easy to use Windows Control Platform and offers a variety of software packages to meet the needs of the most demanding applications. The bonder is designed to be easy to adapt to any size of panel board or any application requirements. The ergonomic design of the bonder allows for easy access to various components and the machine's overall setup flexibility. In addition to its advanced air-controlled technology, EFC ZE1537 provides a safe and secure bond area. The bonder also includes a Quality Assurance Software, which offers the ability to store and quickly refer to multiple user profiles. ZE1537 features an intuitive touchscreen user-interface that allows for easy entry of parameters. The bonder's menu settings are designed to ensure accuracy and consistency in parameters. Additionally, the bonder features a variety of data logging functions, which allow for data diagnosis and process improvements. EFC ZE1537 is equipped with an advanced precision and repeatability system that manages the temperature profile, air pressure and motion of the bond head. This system helps to prevent oxidation, reduce early failures and maintain product reliability. The bonder also has an integrated inspection system to verify successful and defective bond connections. Additionally, ZE1537 allows for up to 20 heating stages to be programmed in the available heating zones to ensure that bonds are successfully completed. EFC ZE1537 has several features that make it a great choice for rapid prototyping and small to medium production applications. These features include a reliable, efficient and repeatable bond process; customized parameter layouts; automated quality assurance; and an intuitive touch-screen user-interface. Other features include data logging for easy process and quality improvements as well as a flexible design, allowing the bonder to be easily adapted to various panel sizes. With these features, ZE1537 is an effective tool for producing high-quality bonded components with reliable speed and accuracy.