Used ESEC 2008 HS3 Plus #9169232 for sale

ESEC 2008 HS3 Plus is a semi-automatic die attach machine that is designed for attaching chip scale and partially/fully die-bonded packages to the lead frame. It is specifically designed to attach small die mounted devices securely with precise results. ESEC 2008HS3PLUS die attach machine is made with a closed-loop monitoring equipment that allows for highly accurate positioning for laydown, thermocompression attachment, and an added external vision system for inspecting die and package parameters before and after attachment. 2008 HS 3 PLUS die attaching machine is designed with ergonomic features for improved user ergonomics, allowing it to be operator friendly. It has an open platform that allows for easy access to components which may need to be replaced or adjusted. The open platform also allows for an unrestricted viewing area to help improve visibility and usability. 2008 HS3 Plus die attach machine has an integrated vision unit that helps ensure optimum die placement and high attachment quality. It also enables the operator to easily adjust the head for any size component that may need to be attached without having to manually adjust the settings each time. ESEC 2008 HS 3 PLUS can be customized to handle various device sizes, including different die mounting sizes, allowing the operator to accommodate a wider range of devices. The positioning head is also motorized, enabling the application of an exact force and heat profile for each application. The machine has a user friendly, automated touch screen interface for easier operation. The software also includes programmable motion parameters which help the operator to achieve the best possible bonding results. 2008HS3PLUS die attach machine has been designed to meet all industry safety standards. It has been certified to meet the Standard for Semi-Automatic Die Attachment Machines, UL508A Ensured. The machine's machine is designed to includes safety features such as an emergency stop button, safety curtains, and safety guard. ESEC 2008 HS3 Plus can achieve a transfer rate of up to 35 die/minutes with repositioning accuracy of 25µm +/- 5µm. It also includes a thermocompression head with adjustable height, power, and temperature for optimal results in die placement and bond registration. It also has a ergonomic design with adjustable control console mounting, user friendly interface, and a range of vision options. ESEC 2008HS3PLUS is a reliable, high performance semi-automatic die attach machine. Its open platform, advanced vision tool, ergonomic design, and safety features help to ensure a secure attachment with precise results. It is designed to meet all safety standards and is certified to UL508A ensuring that this product is safe to use in any environment.