Used ESEC 3006 F/X #149927 for sale

ESEC 3006 F/X is a state-of-the-art bonder featuring advanced imaging and bonding technology. This bonder is designed to provide efficient and reliable bonding solutions for many different applications. It utilizes an infrared camera with an integrated vision system to precisely locate bonding spots with ±1µm accuracy. The X-Y-Z mechanical platform allows for precise alignment and manipulation of bondheads. The vision system is capable of measuring points of up to 0.08mm, automatically adjusting for any vision glitches or inaccuracies. Additionally, the bonder's controls are intuitive to use and can be operated with minimal training. ESEC 3006 F/X is designed with high-resolution laser interferometry which enables it to process the target pattern with great precision. This system has a high dynamic range, allowing it to achieve high-resolution imaging of complex shapes. Furthermore, the bonder features high-speed servo-controlled motion which enables accurate and repeatable speeds with low drift. ESEC 3006 F/X is equipped with ceramic manual operators which can be used to easily adjust the bondhead's position or to perform intricate micro-welds. ESEC 3006 F/X can bond multiple substrates including glass, metals, PCBs, ferrites, and ceramics. The bonder also features an optional laser-based heat-evolved surface conditioner which reduces heat-affected zones (HAZ) and increases weld strength. It is capable of bonding a wide range of surface area types and shapes including flat, round, and curved surfaces. Furthermore, the bonder provides automated calibration feedback to ensure accuracy and repeatability. ESEC 3006 F/X is designed to be cost-effective and reliable. It has a maximum operation temperature of 800°C and is designed to prevent damage due to reactive solders, flux vapors, and high energy flux densities. The bonder also has RF isolation, reducing the possibility of EMI/RFI interference. This bonder also is compliant with multiple certifications, including RoHS and WEEE standards. Overall, ESEC 3006 F/X is an advanced and reliable bonder that can be used for a variety of applications. Its advanced imaging and bonding technology, coupled with intuitive controls, makes this bonder one of the most efficient and precise on the market.