Used ESEC 3006 F/X #156508 for sale

ESEC 3006FX is a state-of-the-art bonder designed to meet the needs of the most advanced industrial and research applications. The unit is capable of providing highly accurate results, with temperature, time and current profiling as well as a wide process range including ball bonding, wedge bonding, and wire pull-off. The model also includes advanced features allowing for additional user-defined process control. The machine is composed of several parts that perform specific tasks. The equipment includes a base unit, location tracking equipment and applicable wire guides. The base unit is a die bonding and wire bonding machine, and is integrated with a control system for the various processes. It consists of two or four peripheral modules connected to each other, each with its own power supply, control panel and output device. The base unit can be switched between operation in manual or automatic mode. The location tracking unit provides for the precise alignment of the needle tip and the wire guide with the location of the substrate or wire. It ensures that the bonder will avoid contact with the device components or any surrounding metal. The wire guide has two sections, each able to accommodate up to four needle tips, and each of these can be adjusted to the length of the wiring wire and locked in place. This enables the highest accuracy in the locations of both the wire guide and the wiring wire. In terms of process control, 3006FX allows for the selection of several pre-set parameters, allowing a wide range of temperature, current, and time settings, as well as fault protection and programmability. It also offers a statistical log feature to monitor the bondable process and make sure that the desired bonding conditions are reached. Lastly, it can also be used together with a computer or external controller for additional control and customization options. Overall, ESEC 3006FX is highly accurate, reliable and versatile bonder designed to meet the needs of the most demanding industrial and research applications. With its numerous features, it is capable of providing consistent, repeatable results and ensuring the highest quality bonds with minimal machine downtime.