Used ESEC 3006 F/X #84887 for sale

ESEC 3006 F/X Bonder is an advanced solder bonder designed by ESEC Corporation. The state-of-the-art, computer-controlled equipment is used to create reliable joint connections on wire and ribbon bonds. The F/X is able to make high-performance bonds that exceed traditional methods of bonding with high reliability. ESEC 3006 F/X Bonder features an easy-to-use touch screen which provides the user with a variety of options allowing for flexibility in bond programs. The user can select from pre-set parameters for various bond configurations, or can customize their own. The available parameters include control of pressure, gap control, pre- and post-heat cycles, bond force, and ramp up/down rates. The user also has the ability to use data logging to monitor bond performance. This automated equipment provides users with a high level of precision and accuracy in the bonding process. It utilizes an advanced bonding head that is able to place and manipulate wire and ribbon bonds precisely and accurately. The F/X Bonder also features a 3-axis motion control system, providing alignment and motion control capabilities which allow the user to create complex bond patterns with ease. ESEC 3006 F/X Bonder is a desktop machine that is ideal for use in a variety of applications. It can be programmed to bond a number of different materials, including gold, aluminum, and tin-copper alloys. This unit can also be equipped with a wide range of advanced tools and accessories, such as an automatic wire feeder, an advanced force control machine, and a dual temperature zone for both pre- and post-heating processes. In short, ESEC 3006 F/X Bonder is a state-of-the-art tool designed to provide reliable joint connections on wire and ribbon bonds. Its advanced features, including the touch screen interface, 3-axis motion control asset, a range of high performance bond options, and the ability to bond a variety of materials, make it an ideal choice for those looking to make reliable, accurate bonds.