Used ESEC 3006 F/X #9163765 for sale

ESEC 3006 F/X is a device designed to bond and/or seal ceramic substrates with metal connections. This bonder is a next-generation device that features an automated fully controlled process to quickly bond substrates. The ability to achieve a temperature-controlled bond is an advantageous feature that is enabled by the precision control of ESEC 3006 F/X. The device features a quartz process chamber that can handle desired temperatures up to 1380°C. The equipment is built with temperature control accuracy of +/-1°C throughout the entire process. This allows for high-quality and repeatable bonds without the need for manual changes. The device is also designed to support various PCB footprints, including the industry standard 1.27mm pitch. ESEC 3006 F/X features an interface that has been designed with a combination of a touchscreen and push button commands. This allows operators to easily change parameters instantly. Process parameters can be modified quickly to adjust bond temperature, length of bonds, and other settings. The unit is also built with multiple safety features in order to prevent any errors while operating. ESEC 3006 F/X bonder is also capable of using multiple types of bonding materials, including solder, nickel, metal oxide, as well as specialty materials such as gold and Indium. This versatility makes the device suitable for a variety of applications. In addition, the system is built with a patented vision unit that is used to inspect and control each bond. The vision machine is designed to detect pin-to-pin and pin-to-ground shorts as well as identify fiducial marks on the substrates. This allows operators to validate that the substrates are bonded correctly. ESEC 3006 F/X is designed to meet the demands of high volume production. The device comes with quality management software that is designed to remotely monitor the process. This allows for a robust and repeatable process that is critical to ensure high-quality products. ESEC 3006 F/X is a powerful and robust tool that is designed to meet the needs of high volume production. The ability to accurately control the bond temperature and the vision tool enable operators to quickly achieve desired products with precision and repeatability. Furthermore, the multiple materials and its capability to support any industry standard footprint make the device a viable choice for many projects.