Used ESEC 3006 F/X #9168732 for sale

ESEC 3006 F/X is an automated bonder designed to meet an array of precision microelectronics joining requirements. It is ideal for microelectronics assemblies, such as attaching semiconductor dies onto printed circuit modules. The bonder offers superior precision and control by using a non-contact infrared heating system that accurately locates and controls the heat level, as well as a programmable dispenser to precisely dispense a range of adhesives and gel materials. ESEC 3006 F/X includes a wide range of features that provide precise and reliable performance, such as a controlled atmosphere sensor, integrated temperature and humidity sensors, and a computer-controlled bonding system. It also allows for non-contact bonding and delivers high throughput and repeatability with low curing time. In addition, the bonder's lithography capability eliminates the need for manual gluing and provides a high level of accuracy and repeatability. ESEC 3006 F/X is designed to optimize throughput and yield in demanding precision microelectronics assembly environments. It is also designed to be easily maintained and operated for optimal reliability and cost savings. Its unique design enables fast change-overs from assembly to assembly, as well as built-in diagnostics for operational checks. ESEC 3006 F/X is available with a range of accessories and add-ons, such as a vibration platform, a blade heater head, a concentric head, and a wedge heater head for quick and easy integration into existing workflows. Additionally, the bonder offers a choice of feeders to ensure the highest accuracy and repeatability. Lastly, it provides access to a variety of material options, such as UV curable, epoxy, and specialty polymers. In conclusion, ESEC 3006 F/X automated bonder is an ideal choice for a variety of precision microelectronics applications. Its range of features and accessories helps to reduce production time while delivering unparalleled accuracy and repeatability, as well as improve the overall yields of production. Furthermore, its modern design and easy-to-use interface make it an ideal solution for companies looking for cost savings, increased efficiency, and reliable performance from their microelectronics joining process.