Used ESEC 3006 F/X #9358595 for sale

ESEC 3006 F/X is a bonder designed to simultaneously bond-press and thermode-process components onto a substrate in one step. This two-step process is faster and more efficient compared to the traditional manual bonding method, allowing for shorter cycle times and reduced process risk. In the press-bonding process, force is applied to the components which establishes electrical connection between the substrate and component. The whole process takes place under controlled temperature, preventing oxidation which is a major problem in the manual bonding process. Certain components come preloaded into ESEC 3006 F/X bonder while others can be loaded by the operator. For the thermode-processing, thermode heads apply uniform temperature onto the component and the substrate at a controlled rate. The heat is quickly removed once the process is complete. ESEC 3006 F/X is equipped with the advanced ECM (Electromagnetic Coupled Membrane) technology, which maximizes the system's process control. The ECM force sensor is used to measure force and ensure accurate assembly pressure is applied. The Pulse Thermode Control enables fine and precise temperature control to match the energy requirements of every component. This ensures the bond is reliable and the thermal stress during the whole process are minimized. ESEC 3006 F/X is fully programmable and configured using the software provided. Bond parameters such as force, temperature, and cycle duration can be set for different components. It also has two automatic corerect functions, the Process Monitor and the Heat Monitor, which help prevent errors and maintain reliable bonding results. Overall, ESEC 3006 F/X is designed to simplify assembly processes, reduce the time and resources required, and improve product safety and reliability. It is a reliable, reliable and robust solution for the process of pressing and thermode-processing components onto substrates.