Used ESEC 3008 #9216643 for sale

ESEC 3008 is an industry grade production tool used for bonding semiconductor chips onto substrates such as printed circuit boards (PCBs). Designed for industrial use, it incorporates industrial-grade hardware with computer numerical control (CNC) for precise chip placement and bonding. It is capable of bonding various types of packages, including ball grid array (BGA), land-grid array (LGA) and quad flat no-lead (QFN) packages, as well as providing multi-body package assembly. 3008 equipment utilizes a platen-mounted vacuum nozzle to pick up and place the chip onto the substrate in a controlled manner. This allows for precise placement and alignment of the chip on the board. The vacuum nozzle is also equipped with an integrated vision system to ensure precise placement and alignment. The CNC functions enable the nozzle to follow a programmed path, ensuring consistent results every time. Additionally, the tool allows for adjustable speed and pressure, depending on the type of chip and application. The tool utilizes three different methods to bond the chip to the board, enabling it to perform a variety of applications: eutectic bonding, epoxy bonding and laser bonding. Eutectic bonding is the process of forming an electrical connection between two metal surfaces by heating them to a specific temperature range; epoxy bonding is the process of joining two surfaces together with an adhesive; and laser bonding is the process of welding two metals together using an infrared laser. ESEC 3008 also comes with a deployment unit to move the vacuum nozzle quickly and accurately over the substrate. This allows it to process up to six PCBs simultaneously, allowing for high throughput for industrial processing. The machine also includes tools for fidicual marking, providing precise location markers to ensure accurate placement of the chip on the board. Finally, 3008 includes a user-friendly graphical user interface (GUI) for intuitive operation. ESEC 3008 is an ideal production tool for industrial-grade chip assembly due to its high accuracy, robustness, and speed. It can effectively and efficiently bond a variety of packages and substrates at high throughputs, making it an ideal choice for mass production.