Used ESEC 3018 #84219 for sale
URL successfully copied!
Tap to zoom
ESEC 3018 is a fully-featured bonder designed for industrial use. It combines advanced bonding technology with a high degree of automation for exceptional performance. It is characterized by its high-speed cycle time, easy operation and high flexibility. 3018 is suitable for a wide range of applications, from ribbon bond wires, to wedge bonds and more. The stationary low-temperature bonding tool has a single head that is equipped with a set of heater coils for substrate temperature control. Additionally, the tool offers a motorized Z-axis for height adjustment with a lifting force up to 1.2 kN and a Z-axis travel of up to 70 mm. As part of the cycle, ESEC 3018 includes an automated bonder verification equipment which checks the quality of the bond after the cycle is completed. This allows the process to be quickly re-run if there is a defect. The tool's Human Machine Interface (HMI) is highly intuitive, allowing operators to easily access features and manage the bond process. Additionally, the HMI allows users to pause and resume the process, as well as to preview the quality of the bond before starting a cycle run. 3018 uses an advanced thermal sensing system for an ideal temperature distribution across the substrate. Operators can select from 4 different heating chambers, each one suitably tailored for the application. This ensures that the heating of the substrate is adjusted correctly for the specific application. The unit is equipped with a wave soldering catcher, allowing it to automatically switch between wave soldering and thermal bonding operations. ESEC 3018 has a dedicated nozzle that's suitable for high-resolution applications, allowing the machine to process various types of bond wires without manual intervention. In terms of safety, 3018 is equipped with several safety features, such as E-stop, a safety breakaway release and emergency stop switch. The tool also has an EN 50119-compliant filtration asset to ensure that all airborne contaminants are kept to a minimum. Overall, ESEC 3018 is an ideal choice for industrial bonding operations. It offers a wide range of flexibility and automation, making it suitable for multiple applications. The model's intuitive HMI allows operators to quickly set up and manage the bonding process. Additionally, the advanced thermal sensing equipment, safety features and dedicated nozzle ensure quality and safety.
There are no reviews yet