Used ESEC 3018 #9037680 for sale

ESEC 3018 is a high-precision, production-class bonder designed specifically for the microelectronic assembly market. It is a fully automated equipment that offers the opportunity to design and manufacture high-precision microelectronic assemblies quickly and reliably. Using a combination of advanced vision systems, high-precision robotic arms, and specialized bonding technology, 3018 is capable of assembling highly complex microelectronic assemblies in a fraction of the time taken by traditional methods. Its highly automated design incorporates an advanced vision system, allowing it to accurately select and place components for the assembly. The vision unit uses computer-aided design (CAD) models of the components to accurately detect and align the components for placement. Additionally, the vision machine can also detect the various bonding characteristics of the components, allowing for greater precision while bonding. The bonder itself utilizes high-precision robotic arms, capable of executing highly precise movements and placement of the components. By utilizing high precision robotic arms, the bonder can operate faster and more accurately than its manual counterparts. Additionally, the robotic arms can move quickly and simultaneously to bond components at various points, providing an even better end result. Finally, the bonder's core technology utilizes specialized bonding processes. Using various different bonding methods such as thermal bonding, ultrasonic bonding, and/or welding, the bonder can accurately and reliably create high quality connections between components. Depending on the materials and characteristics of the components, the bonder can be adjusted to best suit the needs of the assembly. In conclusion, ESEC 3018 bonder is an advanced, high-precision production-class tool for the microelectronic assembly market. Utilizing advanced vision systems, highly precise robotic arms, and specialized bonding technology, the bonder can assemble highly complex microelectronic assemblies in a fraction of the time taken by traditional methods. As such, 3018 bonder is an invaluable tool to any microelectronic assembly operation.