Used ESEC 3018 #9296666 for sale

ESEC 3018 is a bonder designed for thin film module assemblies. It is engineered with features that enable the bonding of intricate structures of various geometries. This bonder has high-speed, full-field, non-contact, and 3D controlled bonding capabilities that provide unmatched speed and performance. The bonder features a large 18" working area with a working area of X/Y260mm and a Z axis of 40mm, allowing for easy assembly of complex structures. The bonder is designed with two independent heads, each with 4 beamlines that provide intense and precise heating and bonding. It utilizes an automated camera system for exact alignment and orientation, and it also supports contact and non-contact bonding tools for precision results. The bonder utilizes a rotational worktable that allows for quick loading and unloading of substrates. It is equipped with a dual simultaneous laser operation system that is capable of performing high-speed, repeatable, and reliable welding and adhesive bonding. The bonder also has the capability to increase the speed of operation and cycle time. It is designed with a simple and user-friendly interface that enables the operators to easily monitor the entire bonding process. This bonder also features advanced thermal control capabilities such as automated temperature profiles, on-the-fly scanning, and a thermal control module to ensure precision bonding results. Furthermore, it has a cooling system that helps to manage the temperature to increase bonding accuracy and reliability. ESEC-3018 is designed to meet the demands of the most intricate applications and is suitable for a wide range of substrates. It provides advanced throughput and accuracy and is ideal for manufacturers looking for an automated solution for thin film assembly applications.