Used ESEC 3088 #293645940 for sale

ESEC 3088 is a high-precision automated die bonder used for the production of high-precision, high-integrity products. This equipment is used mainly for mounting lead frames, components, and assemblies in the production of advanced multilayer, precision hybrid packages in the aerospace, defense and medical industries. 3088 features an advanced vision inspection system with a touch screen monitor, allowing a process engineer to control, monitor and set up process variables on the unit. It also has the ability to independently position bonding heads in a "C-frame" configuration, allowing for independent location, placement and bond of each component. The die bonder has four independent heads for bonding, each equipped with a two-axis Bond Head positioning machine. The Bond Head positioning tool has a high accuracy rate and a resolution of 0.3 micrometer. It can be used for a wide range of die sizes, from 0.5 mm up to 12.5 mm. It also features a dual-axes vision alignment asset that can be switched to provide the best accuracy and highest repeatability of bond results. ESEC 3088 also features a "quad head" die bonder, with a unique 4-head rotation model that can rotate between leads or components. This 4-head equipment allows simultaneous bonding over large area components, or opposed in smaller to medium size parts, providing a higher level of throughput and increased yield. It also allows for the highest precision as each part can be accurately positioned and bonded independently of the other parts. The system is designed for ultra-low temperature die bonding, providing accurate bond temperatures in the range of -150°C to +100°C with a maximum accuracy of ± 0.25°C. This makes it suitable for bonding to difficult materials and for extreme temperature applications. 3088 also provides accurate placement accuracy and repeatability, with a maximum accuracy of ± 10 μm and repeatability of ± 5 μm. The unit is also equipped with an error protection mechanism which will reduce errors in production caused by human error. Overall, ESEC 3088 is a high precision, multi-head die bonder specifically designed for high-precision, high integrity products. It features an advanced vision inspection machine and a unique dual-axes vision alignment tool, as well as a unique 4-head rotation asset and control model all of which are specifically designed to increase throughput, yield and precision. The equipment also offers ultra-low temperature die bonding capability and a high accuracy and repeatability of bond results, making it suitable for a wide range of applications in the aerospace, defense and medical industries.