Used ESEC 3088 #293645983 for sale

Manufacturer
ESEC
Model
3088
ID: 293645983
Wire bonder No BPS.
ESEC 3088 is a fully automated wirebonder used in microelectronics assembly. It is designed to place and bond wires in an efficient, fast and accurate manner. The machine is able to independently loop, tack and trim interconnection wires used in the assembly of components and circuits. With 3088 wirebonder, the user can easily switch between multiple processes including thermosonic gold color cap wiring, kovar and gold wire bonding. ESEC 3088 wirebonder features a single-stage pull up/pull down power subsystem offering a pull-off force up to 200g, as well as a ceramic printer that can be used to place and tack interconnection wires. In addition, the device is equipped with a user-friendly control unit, allowing for easy parameter specification. Thanks to its maximum bond rate of over 4,000 bonds per hour, 3088 is considered one of the fastest bonding machines on the market. The machine is designed for ISO-9001 applications and provides excellent reliability and repeatability. The integrated vision system is capable of providing an extremely accurate placement of the wires and the transmission system is designed to allow for a constant tension on the wires. The unique design of the device also allows for a quick and easy set-up and alignment of the tool, without the need to disassemble the machine. ESEC 3088 wirebonder is suitable for various assembly applications, such as high-density electrical packages, automotive, medical and telecom devices. Its advanced design makes it ideal for high volume production where accuracy, precision and repeatability are of the utmost importance. In addition, the device can be used for wire bonding sizes ranging from 0.08mm to 0.32mm and is compatible with various wire materials and substrates. With its advanced design and high-end features, 3088 is a reliable and robust wirebonding solution for a wide range of applications.
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