Used ESEC 3088 #9124882 for sale

ESEC 3088 is a leading-edge bonder specifically designed to help users in achieving the highest yield through its advanced features. It incorporates a modular transfer chamber, allowing ultimate flexibility to meet the needs of various assembly operations. The machine is a fully-automated front-to-back bonder which facilitates high-speed processing. It utilizes a vision system that can locate parts quickly and accurately. This allows for more precise alignment of parts resulting in fewer defects from parts being misaligned. The bonder is outfitted with a wide range of process capabilities. It has a maximum bond speed of 300 cycles per minute and can handle parts up to 5.12 cm x 5.12 cm. The bonder is equipped with digital controls for temperature and power. A temperature control system is also provided which ensures even heating of both the bond contacts and the bonding surface. Additionally, it can handle a variety of bond types such as wire bonds, wedge bonds, and copper pillars. An auxiliary station allows for the application of special treatments such as glue, solder, and flux to the bonding process. The bonder is designed with a user-friendly control system which facilitates easy set-up and operation. Its wide range of parametric functions streamline workflow and ensure consistent quality in production. The machine also incorporates a suite of monitoring functions which provide users with real-time data regarding machine operation, results, and maintenance. Through its advanced features and flexible design, 3088 bonder is an efficient and reliable solution for various assembly operations. With its robust design, high bond speed and wide range of process capabilities and monitoring options, it is a premier choice for achieving high yields from complicated assembly operations.