Used ESEC 3088 #9217679 for sale

ESEC 3088 is a high-pressure, dual-debonding machine developed and manufactured by ESEC, Inc. An industry leader in microelectronic packaging and interconnection solutions, 3088 offers unsurpassed speed and precision for multi-chip module assembly, flip-chip interposer manufacturing, and other mission-critical debonding applications. The equipment utilizes patented dual-dielectric debonding technology which creates a highly efficient, consistent process for removing components from substrates. The system incorporates a segmented chamber, along with high-accuracy direct-drive actuators, to accurately position components over dual-dielectric pads for the most reliable bond release. The high-pressure debonding process produces minimal dielectric damage and can reduce the overall process time by up to 50%. The unit supports fully automated production processes with configurable input trays and output docks which facilitate quick changeover and accurate component placement. Additionally, an integrated calibration feature ensures the exact repeatability of drilled Dielectric debonding parameters over the entire bond range. The machine also features real-time optical quality monitoring which helps ensure component accuracy and bond integrity for each part. Advanced tools such as an integrated vision tool and specialized precision mapping enable precise part alignment for superior short-term and long-term performance. Further, the touch-screen user interface makes toggling between process parameters simple and intuitive. Overall, ESEC 3088 is an advanced debonding asset designed to meet the needs of the most challenging microelectronic production applications. Its robust dual-debonding technology, automated production processes, and real-time quality monitoring make it an invaluable tool for achieving precise, reliable assembly of components and interconnects.