Used ESEC 3088 #9237285 for sale

Manufacturer
ESEC
Model
3088
ID: 9237285
Vintage: 2001
Wire bonders 2001 vintage.
ESEC 3088 is an advanced and high-performance automatic bonding equipment designed specifically for the processing of standard substrates. This system is extremely precise in its operations and can be used in a variety of applications. It is suitable for the assembly of fine trace and SMD components, as well as for both wire and material bonding. 3088 bonder is easy to use and fits perfectly into most existing production processes. It is operated by a cleanroom-friendly 15" color touchscreen. This unit offers an impressive range of features, including a high-precision placement feature, a secure fiducial camera machine to aid placement accuracy, and a built-in safety feature to help protect against potential hazards. The fiducial camera tool includes advanced, high-speed cameras that are designed to identify the component locations and detect potential misalignments. ESEC 3088 has a distinctive advanced cycle time control feature. This optimizes the quality and speed of the cycle through internal software optimization. It also adjusts the speed of motion according to the components and the material type that is being processed. This ensures the precise, consistent and optimal bonding process. The process of operation of 3088 is as follows. First, the operator uses the menu asset on the control panel to enter the program for the material bonding process to be performed. All the necessary parameters such as temperature, time and pressure will be set and programmed. Then the components to be bonded are placed in the workholder and the workholder is then moved under the bonding tool. Finally, the bonding process is triggered, during which the machine will accurately and rapidly bond the components with the material. With its exceptional bonding performance, ESEC 3088 is the best choice for reliable and precise processes as well as high-security applications. The model features additional improvements such as new, more powerful high-performance electronics and higher resolution, adjustable cameras. As such, it can handle a wide variety of components and materials in a reliable and time-saving manner.
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