Used ESEC 3088 #9302048 for sale

ESEC 3088
Manufacturer
ESEC
Model
3088
ID: 9302048
Wire bonder.
ESEC 3088 is an advanced, high-performance, automated ball bonding machine that offers a high level of repeatability and accuracy. Designed for both manual and automatic operation, this machine uses a unique combination of lateral drive mechanisms and advanced vision systems to achieve superior accuracy and repeatability. 3088 is capable of single-pass or multi-pass ball bonding, with a rapidly adjustable bond pitch and bond size. The machine also offers an external motion equipment for the placement of diffused elements and the bonding of stiffener wires. ESEC 3088 comes with an advanced vision system that enables the accurate inspection of critical parameters such ashead size, chain size, bond pitch, bond size, and bond force. A high-precision pulse motor controls the machine's X-axis movement, providing unrivaled accuracy and repeatability, while an external motion unit with Y and Z axes ensures accurate placement of diffused elements. To ensure maximum bond accuracy, the machine also features adjustable vision machine sensitivity with a selection range of 0.01mm-10mm. 3088 has several advantages over traditional manual ball bonding methods, with up to 10% less bond force required than with manual ball bonding machines. The machine's efficient handling of ball bonding tasks and its increased speed of production also make it ideal for high-volume production facilities. In addition, its exceptional accuracy and repeatability mean that manufacturers can expect consistently high-quality ball bond products. ESEC 3088 is a versatile, robust ball bonding machine which is suitable for a variety of applications. With its advanced vision systems and motor control, it is capable of producing a wide range of ball bonds - from ultra-fine through to robust. Thanks to its advanced design, this machine is also extremely reliable and dependable, making it an excellent choice for manufacturers looking for a reliable and accurate ball bonding machine.
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