Used ESEC 3088 #9302053 for sale

ESEC 3088 is an advanced bonding equipment with multiple application capabilities. It is capable of fully automated operations, providing high accuracy and repeatability levels. The system is equipped with heated working tables, automated Z-axis, as well as a transport unit. The heated working tables enable fast and reliable placements of all components, eliminating the need for manual handling. The automated Z-axis adjusts the table height according to the substrate size, ensuring perfect board-to-bonder alignment. The integrated transport machine allows the machine to move components from the feeders to the working table, avoiding the need for manual handling. The tool is powered by a user-friendly software that helps to minimize programming and setup time. It includes a library of process recipes for most common bonding jobs, making it easy to define any process. It also supports the storage of images, which not only help to maximize the use of the recipe library, but also save time during programming and setup. The machine is equipped with an advanced laser alignment asset. This model provides fast and accurate alignment of the components, ensuring a constant precision for all applications. It also adjusts the size of the component's reflow area, which helps to reduce the reflow time and to improve the process stability. 3088 is equipped with a high-speed vision equipment for optical bond inspection. This system allows automated inspections to detect any potential defects in the bond. The vision unit also supports automated bond length measurements, helping to ensure that the bond lengths are within the required specifications. Overall, ESEC 3088 is a versatile and reliable bonding machine that is capable of fulfilling various bonding applications with high levels of accuracy and repeatability. With its wide range of features, the ECSE 3088 guarantees the flexibility and reliability that most electronics manufacturers need.