Used ESEC 3088 #9302059 for sale

ESEC 3088 is an automatic die bonder designed to increase the efficiency of wire bonding production processes. This fully automated wire bonding machine is ideal for high volume production of products such as rigid-flexible alternating circuits, LED displays or Hybrid/Power/Antenna modules. The machine features a range of advanced automation capabilities, including a computer guided pick-and-place equipment, high accuracy 3-axis manipulator, and a 8-head bonder operation system, allowing for maximum precision. The pick-and-place unit of 3088 robotically positions and retrieves all components and FPCs, and is able to place the components accurately in accurate patterns and orientations. The manipulator can be used to accurately move components and FPCs to the desired position and orientation on the work table, or to the bond finger tool for mesh welding. The 3-axis manipulator allows for a wide range of movement powers, speeds, and force demands. The 8-head bonder operation machine is able to comply with various bonding requirements, including disposable, epoxy, ribbon, wire, and flip chip bonding. Each bonding station is individually processed and determined for optimal accuracy and efficiency during the bonding process. Additionally, the machines' Wafer Level Chip Scale Packaging (WLCSP) feature allows for proper bonding of 3D components. ESEC 3088 also features linear servo motor actuation, precise positioning, and advanced motion control functions that enable high accuracy and repeatability. The machine is designed to operate safely and quietly, with safety interlocks and sensors to protect users from hazards. With its modular design, the resourceful and energy-efficient 3088 is a practical solution for a wide range of industrial wire bonding applications.