Used ESEC 3088 #9302061 for sale

ESEC 3088 is a bonder manufactured by Electro Scientific Industries. It is a multifunctional, low-cost equipment for bonding substrates, connectors and parts for a wide variety of electronic device assemblies. 3088 features a flip-open architecture for quick access to all functional areas. It also has an integrated heat sink that helps maintain a stable temperature for optimal bonding performance. Other features include an LCD touch screen, graphical user interface, dual-stage vacuum chuck, built-in measurement software, and an advanced controller. The two-stage vacuum chuck on ESEC 3088 can provide 100 pounds of force per square inch (PSI) for bonding TAB and QFP leaded devices. It is also capable of handling up to 12-inch leadframes and 1.5-inch strip frames. The integrated heat sink reduces place-head temperature fluctuations. 3088's LCD touch screen displays all the necessary information for operator use, such as parameters, process steps, progress of the bonding operation, and other production data. The LCD indicator can also show production data in tabular or numerical form. The graphic user interface makes the system easy to operate for even inexperienced operators. The on-board software assists with the bonding process, so there is no need to collect and store large amounts of data. The unit also includes a supervised production mode and a series of onboard process alarms for more precise control. ESEC 3088 also supports a wide range of materials and leads. It is compatible with many materials, including epoxy resin, hotmelt, fluxless soldering, and thermoplastic resins. Its leaded devices include QFP, QFN, FT-X, TSOP, PDIP, and SOIC, as well as many others. 3088 has a high throughput rate and is suitable for high-volume production lines. It can save time and money and has been proven to be a reliable bonding machine for many applications.