Used ESEC 3088 #9389547 for sale

ESEC 3088 is a fully automated, high-efficiency die bonder that is suitable for a variety of bonding processes. The machine features micro-precision die attach, die stress relief, chip component placement, and features an integrated vision equipment. This system makes it easy to accurately locate and identify micro-scale objects in just a few seconds; even on tiny components like CPUs, sensors and other surface-mount devices. The easy-to-use and intuitively designed GUI (graphic user interface) ensures an efficient and speedy bond process. The robust design of 3088 allows the user to set and execute their process parameters quickly and accurately. It is designed with an integrated temperature control unit, as well as adjustable force and speed settings. This helps to optimise the accuracy of the entire process as well as the final product quality. ESEC 3088 comes with a wide range of tools and accessories to help tailor the bond process to the user's specific needs. The integrated vision machine helps ensure accurate chip placement and stress relief; and it is designed to be compatible with a variety of camera and chip-handling systems. This machine also features a high-quality, durable Bondhead material and components for long-lasting strength and reliability. For safety, 3088 is designed to offer energy-saving options, as well as protection against overheating. ESEC 3088 also includes in-process monitoring software to ensure that bond quality remains consistent and without deviation. This high-efficiency die bander is capable of processing ICs, diodes, tubing, and nanocomponents with a high precision level. It is suitable for all applications, and can meet the demands of large-scale production, research, and development needs. 3088 is an ideal device for any business that is looking for a reliable, accurate, and efficient way to perform their bonding processes.