Used ESEC 3088 #9396958 for sale

ESEC 3088 is a semi-automatic precision wire bonder designed for use in electronics and microelectronic component packaging. It is capable of forming ball and wedge bonds with fine gold, aluminum, and copper wire. Utilizing two-dimensional control, it can precisely place the bonds in x or y or both. The machine offers Z control to maintain proper bonding forces and is fitted with a precision microscope that allows for greater accuracy during operation. The maximum workpiece size for 3088 is 50mm x 50mm. Ball and wedge bonds are formed using 2.4 to 30 mil square and round wire. A variety of tools are available, including carbon, radius, Teflon, and force trim tools. The machine also supports loops and stitch control for precise loop formation. ESEC 3088 is equipped with an advanced millimeter wave generator to quickly heat and shape the wire, ensuring quality bonds even with the latest high temperature materials. For added safety, the machine is equipped with a setup verification feature which confirms that the device has been set up correctly prior to bonding. The ergonomic design of 3088 offers ease-of-use and accurate manual handling with three separately adjustable bonds on three different positions along the Y-axis, allowing the operator to selectively reach as many as fifty elements on the same workpiece. A vacuum hold down system ensures the reliability and positioning accuracy of all elements during bonding. Overall ESEC 3088 is a top-of-the-line programmable wire bonder that offers improved accuracy and performance when used in precision electronics device packaging. It is the perfect solution for moderately to highly complex device packages, making it the ideal choice for microelectronics component assembly.