Used ESEC 3100 / 3100 Plus #187059 for sale

ESEC 3100 / 3100 Plus is a compact, cost-efficient, automated bonder that is ideal for microelectronic assembly and various other fine-pitch bonding applications. It is an advanced equipment designed for many types of wire and ribbon bonding applications including aluminum and gold ball and wedge wire bonding as well as gold tab bonding. Equipped with precision XYZ stage control, repeatable z-axis Force / Displacement control and enhanced bond loop control, 3100 / 3100 Plus offers excellent performance and flexibility. ESEC 3100 / 3100 Plus is designed with a streamlined robotic arm, enabling high speed and precision with the ability to bond on various substrate heights and sizes. The bonder is also equipped with programmable source control, allowing for custom bonding profiles. With a "smart viewer" on-board camera, 3100 / 3100 Plus can inspect and bond components with unmatched accuracy. In terms of power system requirements, ESEC 3100 / 3100 Plus is able to be used in most commercial and laboratory applications, as it is powered by a standard 120/220 volt AC, single-phase input. This unit uses advanced bonding technology and can be programmed for multiple process recipes on a single platform. Additionally, 3100 / 3100 Plus comes with powerful tools for process optimization and integration with Quality Assurance systems. ESEC 3100 / 3100 Plus is a highly cost-effective machine, capable of bonding most wire materials, such as aluminum, gold and copper. This tool has the ability to bond copper and gold tab wire bonds between 200-3000um pitch and aluminum wire bonds between 20-400um pitch. It also benefits from a high cycle speed of 25-500kHz. 3100 / 3100 Plus is the perfect choice for applications that require high accuracy and repeatability, making it the ideal bonder for microelectronic applications. This bonded machine is easy to use, highly reliable and helps to decrease any repetitive strain for the operator. With an intuitive touch screen display, the user is able to view a comprehensive list of all parameters, making it easy to fine-tune and customize all programs. The manual and automated functions allow for easy operation and automation of the bonding process. Furthermore, ESEC 3100 / 3100 Plus is capable of operation in a semi-clean or clean room environment, offering more flexibility for operation in various environments. Overall, 3100 / 3100 Plus is a highly efficient and reliable asset, offering accuracy and precision with revolutionary technology. It is designed to meet all of the demands when it comes to low-cost, high-precision bonding requirements. It is suitable for multiple applications and able to handle a variety of materials, including but not limited to gold ball wedging, aluminum wedge/ribbon bonding and gold tab wire bonding. With a reliable and versatile design, ESEC 3100 / 3100 Plus is sure to satisfy a wide range of production and assembly needs.