Used ESEC 3100 Optima #293645946 for sale

ESEC 3100 Optima is a highly technical and automated bonder designed for high-precision industrial applications. It is a dual purpose device, combining the functions of bonding, optically-inspected PCB assembly, and epoxy underfill for soldering components on the printed circuit board (PCB). This device utilizes infrared (IR) assisted focused heating to apply a selective pressure over a wide range of localized areas. This process helps the user achieve a highly precise bond which helps prevent any weak spots, being ideal for applications like QFN (Quad Flat No Lead) and BGA (Ball Grid Array) packages. Optimal bond quality is also achieved through a state-of-the-art vision equipment which helps inspect and position the printed circuit boards accurately. This vision system has both image magnification and improved contrast visibility to provide a clear view of the PCB. Additionally, the Optima has an advanced optical alignment unit that offers fine compensation in the XY motors, providing fast and accurate web alignment. Other features of 3100 Optima include a motion control machine which boasts ultra-precise tracking and monitoring. This ensures optimal heat and pressure over localized areas by providing short response time from the IR heaters, an excellent accuracy of less than 1mm across the entire job set, and an improved bond strength. In addition, ESEC 3100 Optima also has a high-performance interface that facilitates communication between the machine and the user. This allows the user to control the bonder quickly and accurately through a simple graphical display. Additionally, this interface can recognize multiple job types, making it easy to switch between different tasks and applications. Ultimately, 3100 Optima is an advanced bonder that offers high precision and reliable bond quality for various PCB assembly applications. It is highly versatile, features an intuitive user interface, and its optically-inspected vision tool and impressive motion control capabilities allows for a highly optimized soldering process.