Used ESEC 3100 Optima #293765455 for sale

ESEC 3100 Optima is a highly efficient and reliable wire bonder designed for the manufacturing of microelectronic packages and lead frames. The core of the machine is its robust, versatile platform, featuring dual linear axes for the controlled positioning of two bond heads. The incredibly wide range of bonding technologies available, from ultrasonic to thermosonic to thermocompression and thermosonic gold ball, enables 3100 Optima to meet the sophisticated requirements of virtually any production environment and application. The dual vision inspection systems featured on ESEC 3100 Optima ensure that each bond is monitored at the highest level even at the highest speeds. Featuring a 2 mega-pixel camera resolution and powerful image processing software, the dual vision greatly increases the accuracy and repeatability of weld placement and monitoring. In addition, the machine is fitted with self-diagnostics, which allow users to quickly identify and remedy any potential faults in the welding process. 3100 Optima is designed to provide precision motion control with high throughput. It features two independent feed mechanisms which dynamically adjust the wire feed rate, ensuring that the wire is flawlessly fed into the bond heads. The adjustable tension lever ensures the proper tension of the wire, maximizing the quality of each bond. The increased reliability and efficiency of the bonder are further enhanced by the optimized electrode tracking and actuation mechanics. The rigid cast aluminum chassis of ESEC 3100 Optima provides an ideal production environment for chip scale and precision pick-and-place applications. The intuitive control panel features a touch screen with detailed information about production and performance, as well as multiple connection ports for programming and data collection. The versatile programming package allows engineers to customize the machine settings to fit the needs of each project. 3100 Optima is an advanced, highly reliable, and cost effective bonder designed to meet the stringent requirements of manufacturers in various industries. Highlighting essential precision motion controls and dual vision inspection as well as an intuitive programming package, ESEC 3100 Optima is the perfect choice for efficient and reliable production of microelectronic packages and lead frames.