Used ESEC 3100 Optima #9124873 for sale

ESEC 3100 Optima is a high-performance microelectronics bonder developed by ESEC, a company specialized in machine engineering. It is designed for automated production in the assembly of lead frames, multi-chip modules and flip-chip device connections. This bonder relies on patented Combined Position Adjustment technology to accurately place parts onto the substrate in the bonding process. It can bond a wide variety of substrates such as glass, ceramic, and polyimide, and is suitable for a wide range of chip sizes. The Optima 3100 has an integrated automatic specimen exchange equipment with automated X-Y-Z positioning of the substrate. This system simplifies the operation process, allowing high-precision die placement on the substrate and subsequent soldering. It is then able to accurately adjust components, such as a lead frame, without having to manually adjust the unit. The Optima 3100 also utilizes a unique high-frequency current monitor and control machine to ensure that the chip is consistently heated and cooled and that the parameters of each soldering process are precisely controlled. This allows for high-quality bonding throughput and minimizes the potential for misalignment or shorts in the bond. In addition, the Optima 3100 is equipped with a self-controllable vision tool. It incorporates an industry-standard CCD camera and image processing Module, to provide quality control over the soldering process. This provides a high degree of accuracy and reliability while minimizing asset downtime. Other key features include high-resolution microscopy, an automatic distance measurement model, and advanced high-temperature soldering functions. It is also designed to minimize footprints and reduce noise levels, making it ideal for any electronics production line. The combination of automated specimen exchange, advanced X-Y-Z positioning, high-frequency current monitor and control, and self-controllable vision make 3100 Optima a powerful tool for efficient and precise microelectronics bonding. It is suitable for a wide range of applications and is highly compatible with various substrates. With its flexibility, accuracy, and reliability, ESEC 3100 Optima is an ideal choice for any microelectronics production.