Used ESEC 3100 Optima #9124894 for sale

ESEC 3100 Optima is a semi-automatic and motorised bonder designed to deliver precision component attachments to substrates. This bonder is suitable for various joining techniques such as soldering, ball bonding and thermocompression. It is also well equipped with vision alignment and accurate dispensing, making it suitable for a wide range of applications from wafer bumping, leaded parts flip-chip and MEMS attachments. 3100 Optima operates using a vision equipment with two cameras for X, Y and Z movement of the substrate stage and the head with the bonder tip. The vision system consists of a twin camera and a backlight unit with LED illumination for easy view of the component and the substrate. This vision alignment machine is able to identify cross-hairs accurately with a maximum component size of 4mm. Additionally, the machine is equipped with a hot air blower tool that can be used to blow air to components or substrate prior to bonding. ESEC 3100 Optima also features an advanced bonding asset which is designed to accommodate a wide range of bonding applications. For soldering, it features three automated temperature controls within the software to maintain bonding stability while maximising throughput; while for ball bonding, it has a wide range of standard and customised bonder tips that can create ultra-fine gold bonding wires of 0.5 mil and up. Additionally, it also enables simultaneous mission of ball and wedge bonds. Moreover, a number of safety features are also present on 3100 Optima. It comes with a safety shield that activates when the bonder is operating, ensuring operator safety. In addition, ESEC 3100 Optima can be programmed to run multiple passes in order to ensure accuracy and eliminate potential errors. The machine is coated with a special rust resistant coating and comes with a user friendly interface that includes detailed step-by-step instructions for easy navigation and operation. In conclusion, 3100 Optima is an advanced semi-automatic and motorised bonder that is suitable for a wide range of attachment applications. Its vision alignment and dispensing accuracy, as well as its advanced bonding model, further allows users to maximise their throughput and achieve reliable, accurate results. In addition to its safety features, the machine also comes with a user friendly interface, making it an ideal choice for numerous attachment applications.