Used ESEC 3100 Optima #9161253 for sale

ESEC 3100 Optima is a modular bonder designed to provide precise and repeatable bonding for flex and rigid circuity assembly. The unit features advanced preheating and placement capability, allowing for superior bond formation in a range of materials and sizes. Powered by a servo driven equipment, the bonder is capable of precise bond trajectory and precise contour following. 3100 Optima has an integrated vision system that works in combination with the servo control unit to provide precise control over bond placement and trajectory. This enables precise placement of round, rectangular and complex shapes as well as detailed inspection of each bond. The vision machine also allows for accurate substrate thickness measurements, enabling greater control of the bonder's process parameters. ESEC 3100 Optima is equipped with a range of tooling options, including soldering, chamfering, plating and polishing tooling that enables the unit to handle a wide range of different circuit assembly requirements. It also features an integrated temperature profile generation tool, allowing for superior control of flux application, reflow and transfer of heat during the bonding process. 3100 Optima has a modular design, allowing for easy customization of the bonder for different applications. Its user-friendly interface allows for easier programming and setup, with all process parameters being easily adjustable from the front panel. Its durable construction and high-end components also ensure long-lasting performance. Overall, ESEC 3100 Optima is an excellent bonder for a range of complex circuit assembly applications, especially in the flex and rigid board assembly markets. It provides superior accuracy and repeatability, enabling superior bonding with minimal scrap rates. With its modular design, advanced preheating and placement capabilities, range of tooling options, and integrated vision asset, 3100 Optima is an ideal solution for cost-effective and repeatable bond formation.