Used ESEC 3100 Optima #9396957 for sale

ESEC 3100 Optima is an advanced bonding equipment designed to provide precision assembly of low temperature, reworkable, and hermetic electronic components. The machine features a benchtop design that incorporates sophisticated controls and inspection techniques. The Optima utilizes three methods to precisely and accurately place and bond small microelectronic components and assemblies: hot bar, ultrasonic, and thermo-compression. The hot bar process uses a customized tool head that heats and oscillates the component while pressure is applied to the top and bottom of the assembly. This method results in a reliable, repeatable bond as the parts are held firmly in place due to the high levels of pressure and heat. The ultrasonic process pulses the assembly at high frequencies, creating friction between the components to create a secure bond. The thermo-compression process uses a low-temperature tool head with a vacuum to compress the solder on the leads. This method is ideal for low-temperature components as it does not require the same level of heat or pressure that the other two processes provide. The Optima provides inspection capabilities during the component assembly process. A high-resolution digital camera can be used to detect defects or misalignments in the parts. Additionally, the system can automatically measure the lead pitch, coplanarity, and standoff heights; this ensures precise alignment between the parts. A range of specialized fixtures is available to ensure the joint is properly formed during the bonding process, and the unit can also be customized for any required joint shape or design. The machine can be trained to automatically recognize component size, configuration, and pin count, eliminating the need for manual template and calibration. Setup time for new components is noticeably reduced and the reliability of the assembly is improved when compared to manual processes. The Optima is a versatile bonding machine that can be used in a wide range of applications from high-end consumer electronics to medical devices and other high-precision assemblies. Its reliability makes it an excellent choice for high-volume production with minimal rework.