Used ESEC 3100 Plus P3 #293645949 for sale

ESEC 3100 Plus P3 Bonder is a state-of-the-art, fully automatic, high-precision die-attach and wire-bonding machine. It offers advanced features and capabilities, which enable it to be suitable for a wide range of applications. The machine was designed to meet the semiconductor industry's needs for reliable, cost-effective and repeatable production processes. 3100 Plus P3 provides advanced wire-bonding technology, requiring less operator intervention, providing improved yields and quality. It consists of an adaptable modular design, which is suitable for various package sizes and bonding requirements. The machine is designed to deliver precision results, with tight control over wire loop parameters, excellent particle control and low parasitic capacitance and resistance. ESEC 3100 Plus P3 is designed with safety in mind, making it a suitable choice for any production environment. This die-attach and bonding machine offers ergonomic and consistent operation, eliminating operator fatigue and ensuring maximum output. With clear and simple operation, quickly adjustable settings and an intuitive user interface, 3100 Plus P3 is easy to set up and to use. The machine is capable of both longitudinal and radial die-attach bonding and up to 30-micron gold wire-bonding. ESEC 3100 Plus P3 features adjustable programmable controls and advanced features, such as auto wire-feeder, temperature control and probe-compensation and dimensional measurement. The built-in camera system provides real-time images for accurate positioning and bonding accuracy. 3100 Plus P3 is fast and efficient, offering shorter cycle times and higher throughput. This can help to reduce labour costs, while providing consistent results and reliability. The machine is also compatible with a range of software solutions, delivering improved traceability, yield and control. Finally, ESEC 3100 Plus P3 is designed to offer quick and easy maintenance, with easy accessibility of all components, ensuring higher uptime.