Used ESEC 3100 Plus #293628014 for sale

ESEC 3100 Plus is a semi-automated, automated wire and die bonding equipment that provides a high degree of accuracy and efficiency. It is capable of operating several types of wire and diebonding, including aluminium, copper and other types of metallization. It is also capable of wirewrap, copper, and hybrid bonding. With a broad range of optional modules and accessories, 3100 Plus is suitable for applications from prototype through high-volume production. The main unit of the system consists of a mainframe, a bonding head, a wire feeder, and associated support stands. The mainframe allows for fast setup and precise control of the unit parameters and settings. The precise bonding head allows for accurate placement of the wire or die, including detection and control of wire tension. The high speed wire feeder ensures precise and uniform endloop formation, improving overall throughput. The machine also features built-in safety features, such as secure mechanical interlocks and contact limiters, to protect the operator and equipment. It is also compatible with various 3rd-party motion controllers, such as those offered by FANUC and Denso, allowing further customization of the tool. ESEC 3100 Plus offers a broad range of advanced performance features, such as the ability to bond multiple dies per loop and in multiple die bonding operations. It is also capable of doing a variety of other operations, such as wire cut-off, wire alignment, and wire tension verification. 3100 Plus comes with a wide range of modular accessories, such as an airborne removal station, workpiece-handling systems, and various die bonding tools. These various tools and options provide excellent speed and accuracy of endloop formation and wire tension control. Overall, ESEC 3100 Plus is an ideal solution for the most demanding requirements, delivering required accuracy, reliability, and excellent throughput performance. With its comprehensive range of tools and options, it can maximize efficiency and productivity throughout your production processes. The asset can be used for all types of die and wire bonding, including aluminium, copper, and other metallizations.