Used ESEC 3100 Plus #293645973 for sale

ESEC 3100 Plus is a reliable and versatile bonder designed to meet the demands of rapid production and prototyping. Its cutting-edge capabilities allow manufacturers to quickly create precision assemblies that meet the highest requirements. 3100 Plus bonder's microprocessor-controlled architecture ensures precise control over the entire bonding process. It is capable of bonding a variety of substrates including silicon, glass, metal, and organic materials. The optimized process parameters can be easily adjusted via a user-friendly touchscreen display. ESEC 3100 Plus bonder offers a number of advanced features, including automatic perimeter trim and option for a second bonding station. Additionally, the highly tool-independent versatility of the system enables users to easily switch between different substrate sizes and bonding layers. The vacuum and temperature sensors, integrated into the unit, provide accurate feedback on process conditions and enable more precise and repeatable results. 3100 Plus employs a patented pressure-distribution technology that precisely controls the distribution and pressure of the bonding layer, and reduces the risk of damage to the substrate surface. The secure bond strength and repeatable performance are further ensured by the system's fail-safe mechanisms for increasing and decreasing the boning pressure. ESEC 3100 Plus has been designed to provide a reliable and consistent performance for high-speed manufacturing and prototyping applications. This bonder is ideal for use in a wide range of industries, including medical, automotive, aerospace, military, and electronics. The user-friendly interface, highly customizable process parameters, and versatile capabilities, make 3100 Plus a dependable solution for any production environment.