Used ESEC 3100 Plus #293645978 for sale

ESEC 3100 Plus is a professional-grade production wire-bonder manufactured by Electro Scientific Industries. It is a versatile, fully automated micropositioner, suitable for a variety of applications including ball bonding and fine-pitch wire bonding. The equipment features a powerful integrated computer-based controller with a graphical user interface, allowing for precise bonding width, height and temperature control. 3100 Plus wire-bonder has been designed to address the challenging needs of today's complex bonding requirements. It is capable of achieving superior bond quality by offering a variety of automated modes such as automatic wire feed, laser scope, and wire placement. These functions can reduce setup time and ensure quality output. The system offers a high performance closed-loop motion control capability, giving users the ability to execute precise bonding without the need of manual control. It also provides multiple monitor support and multi-axis feedback control, enabling precise bond quality. This enables users to accurately and quickly adjust fine-pitch wire bonding parameters in order to maintain optimal bond yield. ESEC 3100 Plus features a powerful integrated computers unit with a touch-screen graphical user interface for ease of use. This machine provides three-dimensional views of components, allowing users to clearly see their parameters and make precise adjustments. The tool also offers an intelligent user prompt asset and an integrated wiring diagram display for quickly diagnosing machine and component conditions. For optimum flexibility, 3100 Plus provides five wire feed options, allowing users to choose from a variety of feed profiles. It also has adjustable wire and ball speed settings, as well as adjustable control parameters for different process conditions. The model can be connected to various test instruments via Ethernet connections to ensure precise testing. In conclusion, ESEC 3100 Plus is a professional production wire-bonder designed to address the challenging needs of precise bond quality. This equipment offers flexible feed options, precise motion control and an integrated graphical user interface for easy operation and adjustment. As a result, users can be assured of quality results and better yields.