Used ESEC 3100 Plus #293645981 for sale

ESEC 3100 Plus is a semi-automatic wire bonder that enables high-precision bonding of both ultra-fine beam wire and ribbon bond on one platform. It supports both gold ball bonds and wedge bonds with variable solder time, current and power. The advanced closed-loop servomotor control improves accuracy that can reach down to +/- 0.2mm in step and repeat mode, making it ideal for bonding pre-shaped and customized components. 3100 Plus has a large work envelope, tailoring to various applications such as molded assemblies, heat sinks, LEDs, flat package devices, and single-chip modules. It also features the 'EPW', an auto wire pre-forming system that helps to achieve proper wire shape ahead of the actual bonding process, resulting in reliable bonds with minimized failure caused by improper wire form. The rotary table allows multiple wafers to be aligned and bonded simultaneously. This reduces space and lowers set-up costs as well as minimizes coverage time and improves production efficiency. The flexibility of the architecture also allows it to be combined with other processes such as dispense, inspection, and even systems with post-bonding processes. ESEC 3100 Plus has a user-friendly computer interface with extensive remote control capabilities so that the operator can view and adjust parameters from a remote location. This ensures maximum productivity and reliability from the product. It also offers a variety of options such as manual, semi-automatic, and automatic loading for a wide range of industries. 3100 Plus, being highly accurate, durable, and user-friendly, offers unique solutions for various bonding applications. Its advanced closed-loop servomotor control and EPW ensure excellent repeatability, resulting in high-precision, reliable bonds. Its versatile configuration and design, along with the ability to integrate additional processes, makes it the ideal choice for an array of industries.