Used ESEC 3100 Plus #293658689 for sale

Manufacturer
ESEC
Model
3100 Plus
ID: 293658689
Vintage: 2007
Wire bonder 2007 vintage.
ESEC 3100 Plus bonder is a high-performance, medium-speed automated bonding machine designed to meet the demands of today's electronics industry. Utilizing state-of-the-art technologies, 3100 Plus delivers performance and productivity unheard of until now. ESEC 3100 Plus is a three-axis machine featuring an integrated high-speed placement head and a robotic gantry and workpiece handling. The equipment is capable of handling both single and multiple bonding processes, accommodating board sizes up to 18" x 24". The machine's performance is delivered through its combination of robust servo robotics, advanced control systems, and software. The integrated high-speed placement head allows for detailed control of the bonding parameters, helping to increase accuracy and reduce production time. The system also offers the capability for automatic bonding parameter adjustment, which maximizes performance and reduces overall tooling costs. 3100 Plus bonder is tailored to meet the needs of today's electronics industry, with an intelligent user interface allowing for easy setup and intuitive operation. The user interface also offers intuitive part and job selection functions, which help automate the process of meeting specifications. The unit also offers an automatic camera machine, allowing for easy part location and automatic tooling compensation. This camera tool also allows for easier identification of defective parts, helping to improve product quality and reduce downtime. ESEC 3100 Plus bonder also offers a wide range of production quality features. The asset has a highly repeatable accuracy of 0.0025mm, and a precision of 0.1mm. The model is designed for continuous production and offers a rapid cycle time of up to 4.5s. 3100 Plus also features an integrated CAD equipment, which allows connection to outside databases, as well as an integrated internal database. ESEC 3100 Plus offers excellent performance and a wide range of production quality features, making it perfect for the high-performance, medium-speed applications more common in today's electronics industry. The intuitive user interface, along with advanced control systems, make this system easy to use, and tailor to meet the most demanding requirements. With all these features, 3100 Plus is poised to become a benchmark for medium-speed bonding solutions.
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