Used ESEC 3100 Plus #293749425 for sale

ESEC 3100 Plus is a fully automated precision bonder specifically designed for fine-pitch wire bonding. This industrial bonder is suitable for all kinds of semiconductor packaging, including Chip-on-Board (COB) packages, MEMS, Multi-Chip Modules (MCMs), System-on-Chip (SoC) packages, and WLCSP (Wafer-Level Chip-Scale Packages). This high-end tool features an accurate and repeatable performance with the options of thermocompression, thermocompression and ultrasonic bonding, providing the best wire bonding solutions for the most demanding packages. The unique thermocompression technology utilizes high RF (12.5kHz) to achieve optimal heat transfer and bond force to build up strong and uniform bonds. This technology is also complemented by the thermo-compression and ultrasonic bonding that provide even higher bond force and greater durability. 3100 Plus bonder also offers a wide range of specialized tools for different tasks. Its pulse programmable 12-axis robot is specially designed for large packaging and array packages, and its precision optics ensure utmost accuracy for all kinds of bonding work. ESEC 3100 Plus also offers precise wire placement capabilities, with a programmable envelope technology that allows it to precisely determine the location of each wire and the necessary bond force to ensure tight and reliable bonds. In addition, 3100 Plus comes with a built-in vision system for automated inspection and analysis of bond quality. This system reduces human intervention and enables consistent quality checks, leading to significant time savings without compromising on quality. Overall, ESEC 3100 Plus is the ultimate bonder for all kinds of high-precision packaging needing higher bond force and tighter, strongly bonded connections. This precision bonder is an ideal choice for all SEMI-JEDEC related wire bonding projects.