Used ESEC 3100 Plus #293768257 for sale

ESEC 3100 Plus (also known as the 3100+) is a superior bonder for packaging, automotive, consumer electronics, aerospace, and medical device applications. The 3100+ is a reliable and efficient platform for connecting and sealing a multitude of substrates. It utilizes innovative sealed-field technology to provide superior Seal Control, allowing manufacturers to significantly reduce rework or scrap due to faulty sealing processes. The 3100+ is designed with dedicated programming, fast cycle times, and wafer-level bonding solutions which provide increased throughput and improved efficiency for even the most complex applications. The 3100+ utilizes a Dual-Stage, Multiprocess Heating Control feature which offers precise control of both heating and cooling functions, ensuring that the desired heat is applied in an appropriate manner. This prevents overheating and provides increased draw-down potential, which results in precise control over the amount of heat applied to the substrates. Furthermore, the 3100+ is configurable with up to 8 heat zones and 6 channels, allowing flexible, custom processing configurations to suit specific customer requirements. In addition, the 3100+ is an industry leader in precise electrostatic placement technology and is capable of precision alignment and placement of components as small as 75 microns. The 3100+ also provides 'smart pickup' capabilities, a powerful feature which can pick up components from a variety of different substrates with same placement accuracy, regardless of the substrate height. This feature ensures yield and cost savings, as well as improved durability with repetitive stitching accuracy. The 3100+ is also designed with an advanced vision system that enables it to optimize the placement of components in applications where there are multiple components with varying sizes and shapes. The vision system can inspect and detect any part of the process, allowing the machine to compensate quickly when any defects, misalignment, wafer misalignment, and other problems are detected. The 3100+ offers additional features such as integration, on-the-fly adjustment of inter-seal time, closed loop pressure control and closed loop temperature control. It is also designed for easy engine expansion, meaning it can easily accommodate additional components as demand grows. In summary, the 3100+ is a superior bonder which provides unparalleled performance and precision. It is an ideal solution for a wide variety of applications including consumer electronics, automotive, aerospace, and medical device applications. Features such as its Dual-Stage, Multiprocess Heating Control, precise electrostatic placement technology, advanced vision system, and integration capabilities, make it a reliable and powerful solution for manufacturers wanting to maximize the quality and yield of its products.