Used ESEC 3100 Plus #293800595 for sale

ESEC 3100 Plus bonding machine is a versatile and highly efficient bonder designed to meet the needs of semiconductor device manufacturers. It is capable of handling large volumes of components with precision and speed. It can handle both fine-pitch and low-volume packages, as well as larger-sized packages. Its high speed operation allows it to bond single, double, or multi-layered packages with accuracy. 3100 Plus is equipped with a unique OptoPure optics and digital imaging equipment that combines the highest level of accuracy with an intuitive interface. It offers an impressive set of functions, such as precisionimage capturing, bond force monitoring, and advanced image processing. The OptoPure optics system also provides superior bond alignment and precise control of the bond process. In addition, the machine is built with a Patterning Radial Helical (PRH) bonding technology, which allows it to rapidly and precisely form larger or more intricate metal parts. The machine can bond components with fine-threaded terminals and lead-less chip carriers, which is ideal for the exacting applications of semiconductor device manufacturers. ESEC 3100 Plus is constructed with a sturdy frame and is equipped with a touchscreen display for easy operation. The unit also features a comprehensive set of safety features, such as an automated emergency stop machine and easy-to-use emergency power shutdown. 3100 Plus is capable of high-speed, repeatable, and accurate bonding with precision alignment and force control. It is especially suited for the needs of semiconductor device manufacturers that require high-throughput bonding of intricate components, as well as those who need to bond finer and larger parts.