Used ESEC 3100 Plus #9208251 for sale

ESEC 3100 Plus is a state-of-the-art die attach bonding platform that offers an array of high-precision capabilities for customers in the semiconductor, automotive, medical and consumer electronics industries. The equipment features many of the same features as its predecessors, including an incredibly precise Motion Handling System with repeatable motion control. The unit's advanced automation and advanced vision systems make it capable of automatically and accurately controlling 3-axis Motion Handling, including X/Y/Z and XYZ+ rotary, bond-head to part-thermal-compensation (BTPC) stepping, die inspection, vision correction, precision alignment, and die attach execution. 3100 Plus is the ultimate choice for customers looking for versatility and integration on the assembly line. The machine offers a range of features that make it suitable for small to large parts, including die placement, singulation, optical marking, double-side work, and many more. Its modular design allows for easy configuration of multiple bond-heads that can be optimized for a given application, while the repeatable motion control ensures that the best possible results are achieved. ESEC 3100 Plus's advanced automation capabilities allow users to focus on their production, as the tool is capable of self-calibration, material handling, vision systems, feedback control for product quality and set-up automation. This means less manual intervention is necessary, resulting in improved quality control, higher production efficiency, and shorter cycle times. Moreover, its special production environment control features ensure consistent quality results irrespective of external environmental conditions. The asset's advanced vision model supports precision alignment and die-placement accuracy, and its high-resolution die attachment capability ensures superior bond integrity for long-standing electrical conductivity and mechanical strength. The equipment's fool-proof programming feature also helps reduce rejects and provides users with excellent production yields. 3100 Plus is a cutting-edge and highly reliable die attach bonding system. Its user-friendly operation, high-precision motion control, and comprehensive automation unit make it an ideal choice for high-volume production operations.