Used ESEC 3100 Plus #9217481 for sale

ESEC 3100 Plus Bonding Machine is a versatile, high-quality bonding instrument designed to provide precision interconnections in the world of electronics assembly. The machine is suitable for a variety of microelectronic device interconnections, including flip chip, QFP, and BGA. It features a powerful hot-bench, high thermal capability, as well as an improved system design and ergonomics to give the user the flexibility to bond in the most challenging applications. 3100 Plus is entirely designed and manufactured by ESEC, so accuracy is ensured when connecting structures and components to a board substrate. The machine includes a thermally controlled work area and provides a consistent, isolated environment during processing, which allows complex design patterns to be completed with ease. It also allows components such as QFP and BGA to be processed in a higher layer count than is typical with other tools. With its multi-axis, temperature regulated table, ESEC 3100 Plus allows users to accurately control the temperature of the board, as well as the interconnects they are bonding to it. When it comes to precision, 3100 Plus has a specially designed robotic arm that can move in one, two, or three axis, and can be programmed to bond points with deviating gap values. This makes the machine a great choice for more complicated designs, where a greater level of precision is needed. ESEC 3100 Plus is also capable of performing wire bonding operation using an array of current and voltage settings. Additionally, the machine offers a self-cleaning system that helps to maintain the desired temperature and prevent contamination. Overall, 3100 Plus is a highly advanced and efficient bonding machine that allows even the most high-end electronic components to be connected accurately and efficiently. Its many features make it an excellent choice for accomplishing even the most complex tasks in the cleanroom.