Used ESEC 3100 Plus #9218631 for sale

ESEC 3100 Plus is a high-performance wire and ribbon bonder that provides superior performance in the most demanding production environments. The equipment offers a variety of features and options that make it ideal for bonding and packaging of semiconductor devices and components, as well as for fast, accurate and reliable wire bonding processes. 3100 Plus model is equipped with an easy-to-use user interface, a powerful high-speed motor and an integrated vision system, allowing users to quickly and accurately inspect up to 32 bonding sites without disrupting production. This advanced combination makes the unit ideal for the most challenging bonding applications. The technology used in ESEC 3100 Plus is designed to optimize wire and ribbon orientation and placement. The bond head technology allows uniform thickness and profile control, exceptional accuracy and repeatability, and fast cycle times. This results in greater efficiency and lower manufacturing costs. In addition, the advanced closed-loop control machine used in 3100 Plus ensures consistent performance and outstanding quality. ESEC 3100 Plus features a state-of-the-art integrated vision tool. The vision asset works together with the patent-pending Intelligent Bond Motion (IBM) motor to identify, accurately locate and precisely bond components. The vision model is fully integrated with the proprietary software library, allowing users to quickly and automatically adjust and correct any out-of-specification material or component pattern. Life-time tracking and monitoring features are also available, providing easy access to current and past production statistics. 3100 Plus includes a host of features that enhance bonding equipment performance. These include the dual axis water chiller for maintaining consistent process temperatures, an AC heater controller for reliable and accurate temperature control, and the ability to process multiple wire bond sizes simultaneously. This all-in-one bonder offers high-precision wire and ribbon placement, reliable closed-loop process control, and a vision system for precise component identification. Overall, ESEC 3100 Plus is an ideal solution for efficient and reliable production of semiconductor packages and devices, and other sensitive electronic components.