Used ESEC 3100 Plus #9219384 for sale

ESEC 3100 Plus is an advanced wafer bonder designed to support the processes of wafer-level packaging. This is a semi-automatic machine for die-to-die, die-to-wafer and substrate-to-wafer bonding. It uses thermal compression or thermocompression bonding techniques to form a hermetic bond between two surfaces. The equipment has a modular design and offers several configurations. The configuration includes a mounting stage, a heating and crystal oscillator section, a cooling section, and a bonding section. The system has a motorized X-Y-Z axis, and can be equipped with up to three pairs of four-quadrant electrostatic chucks. This allows for precise control of the alignment of the wafers during bonding. The unit uses a combination of heating and pressure technology. Two temperature sensors monitor the temperature of the bonding materials, and the heating mechnism effectively and evenly distributes heat to both surfaces. When the materials reach bonding temperature, the machine applies pressure to form a strong bond. The tool also includes a programmable force sensor that monitors the pressure being applied. The asset offers a number of features to ensure precision during the bonding process. This includes real-time prismless alignment designed to automatically adjust the X-Y position of the wafers; an area scanner for accurate surface inspection; and a pressure profiler for profiling pressure distribution across the surface. 3100 Plus is equipped with a control software that provides an intuitive user interface and remote access. The operator can quickly set the desired parameters, initiate a program geneartion, and observe the bonding process. The model also includes different user profiles that allow the user to quickly access and begin the program. To ensure safety and reliability, the equipment has an over-temperature protection system, and an automatic vacuum pump teardown feature. The unit is certified with CE, UL, and EMC and can be used in various industrial applications.